Component placement systems and methods of operating the same

ABSTRACT

A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of U.S. Provisional Application No.63/122,200, filed Dec. 7, 2020, the content of which is incorporatedherein by reference.

FIELD

The invention relates to component placement systems for placingelectronic components, and in particular, to improved componentplacement systems for placing multiple electronic components, andmethods of operating the same.

BACKGROUND

In the electronics assembly industry, pick and place systems (i.e.,component placement systems) are used for the placement of electroniccomponents. In certain placement systems, a plurality of tools (e.g.,pick up tools, pipettes, nozzles, etc.) may be carried by a single bondhead array. Thus, a plurality of electronic components (each carried bya distinct tool) may be carried at the same time by the bond head array.

Often, multiple bond head arrays are included on a single placementsystem. Such placement systems suffer from a number of deficiencies, forexample: high costs of parts; complex motion systems for each bond headarray; complex movement paths; throughput inefficiencies; etc.

Thus, it would be desirable to provide improved component placementsystems that overcome one or more of the deficiencies of conventionalplacement systems.

SUMMARY

According to an exemplary embodiment of the invention, a componentplacement system is provided. The component placement system includes: afirst bond head array configured for simultaneously carrying a firstplurality of electronic components; a second bond head array configuredfor simultaneously carrying a second plurality of electronic components;a first motion system for simultaneously carrying the first bond headarray and the second bond head array along a first motion axis; and asecond motion system for carrying the first bond head array independentof the second bond head array.

According to another exemplary embodiment of the invention, a method ofoperating a component placement system is provided. The method includesthe steps of: (a) carrying a first plurality of electronic componentsusing a first bond head array; (b) carrying a second plurality ofelectronic components using a second bond head array; (c) moving thefirst bond head array and the second bond head array along a firstmotion axis simultaneously using a first motion system; and (d) movingthe first bond head array independent of the second bond head arrayusing a second motion system. As will be appreciated by those skilled inthe art, such a method may include additional steps (e.g., using thecomponent placement systems recited in connection with any of theexamples shown and described herein, or otherwise within the scope ofthe invention).

According to yet another exemplary embodiment of the invention, anothercomponent placement system is provided. The component placement systemincludes: a first support structure carrying a plurality of linearmotion systems, each of the linear motion systems being configured tomove one of a plurality of pick up tools; a second support structure forcarrying the first support structure; and a rotative motion system formoving the first support structure with respect to the second supportstructure about a rotative motion axis.

According to yet another exemplary embodiment of the invention, anothermethod of operating a component placement system is provided. The methodincludes the steps of: (a) carrying a plurality of linear motion systemsusing a first support structure, each of the plurality of linear motionsystems being configured to move one of a plurality of pick up toolsconfigured for carrying an electronic component; (b) carrying the firstsupport structure with a second support structure; and (c) moving thefirst support structure with respect to the second support structureabout a rotative motion axis using a rotative motion system.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is best understood from the following detailed descriptionwhen read in connection with the accompanying drawings. It is emphasizedthat, according to common practice, the various features of the drawingsare not to scale. On the contrary, the dimensions of the variousfeatures are arbitrarily expanded or reduced for clarity. Included inthe drawings are the following figures:

FIG. 1 is a block diagram top view of a component placement system inaccordance with an exemplary embodiment of the invention;

FIG. 2 is a block diagram top view of elements of a component placementsystem in accordance with an exemplary embodiment of the invention;

FIG. 3 is a block diagram top view of elements of another componentplacement system in accordance with another exemplary embodiment of theinvention;

FIG. 4 is a block diagram top view of elements of yet another componentplacement system in accordance with yet another exemplary embodiment ofthe invention;

FIG. 5 is a block diagram top view of elements of yet another componentplacement system in accordance with yet another exemplary embodiment ofthe invention;

FIG. 6 is a block diagram top view of elements of yet another componentplacement system in accordance with yet another exemplary embodiment ofthe invention; and

FIGS. 7-8 are flow diagrams illustrating methods of operating componentplacement systems in accordance with various exemplary embodiments ofthe invention.

DETAILED DESCRIPTION

As used herein, a “bond head array” refers to a bond head configured forcarrying a plurality of pick tools (e.g., pick and place tools, such aspipettes, grippers, etc.) in connection with placement operations.

In accordance with the invention, various exemplary “motion systems” aredescribed herein. The term “motion system”, as used herein (including inthe claims), may refer to a single motion system (e.g., a single motionsystem as illustrated and described in connection with the drawings) orto a plurality of motion systems. For example, referring to FIG. 1 , ay-axis motion system 104 and two x-axis motion systems 108 aredescribed. Collectively, these three motion systems (i.e., the y-axismotion system 104 and the two x-axis motion systems 108) move the bondhead arrays 106 a, 106 b along the y-axis and the x-axis. Thus,collectively, these three motion systems (i.e., the y-axis motion system104 and the two x-axis motion systems 108) may be considered a singlemotion system within the scope of the invention. Accordingly, any singlemotion system or any group of motion systems described herein may beconsidered a “motion system” within the scope of the invention.

In accordance with various exemplary embodiments of the invention,component placement systems/devices are provided that pick and/or placeelectronic components simultaneously. Such component placement systemsmay include two (or more) bond head arrays residing on a single longstroke actuator (e.g., a long stroke y-axis actuator, a long strokex-axis actuator, or both). The bond head arrays can be positionedindependently from each other enabling parallel picking and/or parallelplacement.

In accordance with the scope and spirit of the invention, many differentvariations are contemplated. Exemplary variations include: (a) one longstroke y-axis manipulator (e.g., see y-axis motion system 204 in FIG. 2), with two bond head arrays which can be positioned independently fromone another in an XY-plane using long stroke x-axis actuators (e.g., seex-axis motion systems 208 a, 208 b) and a short stroke y-axis actuator(e.g., see y-axis motion system 220) (e.g., see FIG. 2 ); (b) one longstroke XY manipulator (e.g., where such a manipulator may include motionsystems 304 and 308 a in FIG. 3 ), one bond head (e.g., where such abond head may include bond head arrays 306 a, 306 b in FIG. 3 )containing two arrays that can be positioned independently in anXY-plane using two short stroke linear actuators (e.g., see FIG. 3 );(c) one long stroke XY manipulator (e.g., where such a manipulator mayinclude motion systems 404 and 408 a in FIG. 4 ), one bond head (e.g.,where such a bond head may include bond head arrays 406 a, 406 b in FIG.4 ) containing two arrays that can be positioned independently in anXY-plane via two short stroke linear actuators, where the combination ofthe two arrays can be rotated, where by rotating the arrays 180 degreesthe order of the arrays can be swapped (e.g., the pipettes on the rightmove to the left and vice versa) (e.g., see FIG. 4 ); (d) one longstroke XY manipulator (e.g., where such a manipulator may include motionsystems 504 and 508 a in FIG. 5 ), one bond head (e.g., where such abond head may include bond head arrays 506 a, 506 b in FIG. 5 )containing two arrays that can be positioned independently in anXY-plane using a single short stroke linear actuator and a rotationalactuator, where by rotating the arrays another 180 degrees, the order ofthe arrays can be swapped (e.g., the pick up tools (e.g., pipettes) onthe right move to the left and vice versa) (e.g., see FIG. 5 ); and (e)one long stroke XY manipulator (e.g., where such a manipulator mayinclude motion systems 604 and 608 a in FIG. 6 ), one bond head (e.g.,where support structure 622 may be considered such a bond head)containing three pick up tools (e.g., pipettes) that can be positionedindependently in an XY-plane via three short stroke actuators combinedwith a rotational actuator, where by choosing the right positioning ofthe linear actuators combined with the rotation angle, the three pick uptools (e.g., pipettes) can be arranged in any order (e.g., see FIG. 6 ).Of course, other variations within the scope of the invention arecontemplated.

In accordance with certain exemplary embodiments of the invention, areduced number of long stroke axes are utilized in a component placementsystem. In a specific example, for a second bond head the long strokeaxis is replaced by a short stroke axis reducing COGS (i.e., cost ofgoods sold). The short stroke axis enables the second bond head to bepositioned independently of the first (e.g., main) bond head. In such anexample, there is only one (e.g., long stroke) manipulator, with theadditional degrees of freedom supplied by the short stroke axis/axes.

Referring now to the drawings, FIG. 1 illustrates a component placementsystem 100. Component placement system 100 includes feeding area 102 forsupplying various electronic components to be picked and placed ontosubstrate 114 (of course, multiple substrates 114 may be provided toreceive electronic components). A look-up camera 112 (or other visionsystem element) is provided for alignment, inspection, etc. Exemplarybond head arrays 106 a, 106 b are illustrated in FIG. 1 , each includinga plurality of pick up tools 110 (e.g., pick and place tools, such aspipettes, grippers, etc.). A y-axis motion system 104 is provided tomove each of bond head arrays 106 a, 106 b simultaneously along they-axis of component placement system 100. A separate x-axis motionsystem 108 is provided for each of bond head arrays 106 a, 106 b—to movethem separate from one another along the x-axis of component placementsystem 100. An additional y-axis motion system 120 is illustrated forbond head array 106 b for moving its pick up tools 110 along the y-axisof component placement system 100 without bond head array 106 a.

The details of bond head arrays 106 a, 106 b (and their associatedsupport structures, pick up tools, and motion systems) are exemplary innature. It is understood that any of the configurations illustrated inFIGS. 2-6 , or any other configuration within the scope of theinvention, may be implemented in a component placement system includingelements such as those illustrated in FIG. 1 (including feeding area102, substrate 114, look-up camera 112, etc.).

Referring now to FIG. 2 , bond head arrays 206 a and 206 b areillustrated. A support structure 216 carries each of bond head arrays206 a, 206 b. Further, another support structure 214 carries supportstructure 216 (and hence each of bond head arrays 206 a, 206 b). Morespecifically, support structure 216 (and hence each of bond head arrays206 a, 206 b) can be moved along the y-axis of the component placementsystem using a y-axis motion system 204 (e.g., a long stroke actuator).Bond head array 206 a is carried by an x-axis motion system 208 a (via asupport structure 218), thereby being moveable along the x-axis of thecomponent placement system. Likewise, bond head array 206 b is carriedby an x-axis motion system 208 b, thereby also being moveable along thex-axis of the component placement system. Bond head array 206 a is alsomoveable along the y-axis of the component placement system using ay-axis motion system 220 (e.g., a short stroke actuator). Each of bondhead arrays 206 a, 206 b includes a plurality of pick up tools 210(e.g., pick and place tools, such as pipettes).

Thus, in summary, FIG. 2 illustrates a single long stroke y-axis motionsystem 204 for carrying the two bond head arrays 206 a, 206 b. Each ofbond head arrays 206 a, 206 b can be moved independently along thex-axis using respective x-axis motion systems 208 a, 208 b (e.g., linearactuators). Finally, bond head array 206 a can be moved along the y-axisusing y-axis motion system 220.

Referring now to FIG. 3 , bond head arrays 306 a and 306 b areillustrated. A support structure 316 carries each of bond head arrays306 a, 306 b. Further, another support structure 314 carries supportstructure 316 (and hence each of bond head arrays 306 a, 306 b). Morespecifically, support structure 316 (and hence each of bond head arrays306 a, 306 b) can be moved along the y-axis of the component placementsystem using a y-axis motion system 304 (e.g., a long stroke actuator).Bond head array 306 a and bond head array 306 b are both carried by anx-axis motion system 308 a (e.g., a long stroke actuator), thereby beingmoveable along the x-axis of the component placement system. Bond headarray 306 a is also moveable along the each of the x-axis and the y-axisof the component placement system independently of bond head array 306 b(although 306 a of FIG. 3 is illustrated supported/constrained by rollerbearings in both X and Y directions (thus restricting travel) forsimplicity, it is understood that an additional support structureseparating the directions could be used). More specifically, bond headarray 306 a may be moved along the x-axis, independently of bond headarray 306 b, using an x-axis motion system 308 b (e.g., a short strokeactuator). Further, bond head array 306 a may be moved along the y-axis,independently of bond head array 306 b, using a y-axis motion system 320(e.g., a short stroke actuator). Each of bond head arrays 306 a, 306 bincludes a plurality of pick up tools 310 (e.g., pick and place tools,such as pipettes, grippers, etc.).

Thus, in summary, FIG. 3 illustrates (i) a single long stroke y-axismotion system 304 for carrying the two bond head arrays 306 a, 306 b;and (ii) a single long stroke x-axis motion system 308 a for carryingthe two bond head arrays 306 a, 306 b. Further, bond head array 306 acan be moved independently from bond head array 306 b along the x-axisusing x-axis motion system 308 b, and along the y-axis using y-axismotion system 320.

Referring now to FIG. 4 , bond head arrays 406 a and 406 b areillustrated. A support structure 416 carries each of bond head arrays406 a, 406 b. Further, another support structure 414 carries supportstructure 416 (and hence each of bond head arrays 406 a, 406 b). Morespecifically, support structure 416 (and hence each of bond head arrays406 a, 406 b) can be moved along the y-axis of the component placementsystem using a y-axis motion system 404 (e.g., a long stroke actuator).Bond head array 406 a and bond head array 406 b are both carried by anx-axis motion system 408 a (e.g., a long stroke actuator) (via a supportstructure 424), thereby being moveable along the x-axis of the componentplacement system. Bond head array 406 a and bond head array 406 b arealso both carried by a rotative motion system 426 (via a supportstructure 422), and thus bond head array 406 a and bond head array 406 bare simultaneously carried about a rotative motion axis (i.e., carriedabout the z-axis). For example, by rotating 180 degrees, the order ofthe arrays can be swapped (e.g., the bond head array on the right movesto the left and vice versa).

Bond head array 406 a is also moveable along the each of the x-axis andthe y-axis of the component placement system independently of bond headarray 406 b (although 406 a of FIG. 4 is illustratedsupported/constrained by roller bearings in both X and Y directions(thus restricting travel) for simplicity, it is understood that anadditional support structure separating the directions could be used).More specifically, bond head array 406 a may be moved along the x-axis,independently of bond head array 406 b, using an x-axis motion system408 b (e.g., a short stroke actuator). Further, bond head array 406 amay be moved along the y-axis, independently of bond head array 406 b,using a y-axis motion system 420 (e.g., a short stroke actuator). Eachof bond head arrays 406 a, 406 b includes a plurality of pick up tools410 (e.g., pick and place tools, such as pipettes, grippers, etc.).

Thus, in summary, FIG. 4 illustrates (i) a single long stroke y-axismotion system 404 for carrying the two bond head arrays 406 a, 406 b;(ii) a single long stroke x-axis motion system 408 a for carrying thetwo bond head arrays 406 a, 406 b; and (iii) a single rotative motionsystem 426 for carrying bond head array 406 a and bond head array 406 babout a rotative motion axis. Further, bond head array 406 a can bemoved independently from bond head array 406 b along the x-axis usingx-axis motion system 408 b, and along the y-axis using y-axis motionsystem 420.

Referring now to FIG. 5 , bond head arrays 506 a and 506 b areillustrated. A support structure 516 carries each of bond head arrays506 a, 506 b. Further, another support structure 514 carries supportstructure 516 (and hence each of bond head arrays 506 a, 506 b). Morespecifically, support structure 516 (and hence each of bond head arrays506 a, 506 b) can be moved along the y-axis of the component placementsystem using a y-axis motion system 504 (e.g., a long stroke actuator).Bond head array 506 a and bond head array 506 b are both carried by anx-axis motion system 508 a (e.g., a long stroke actuator) (via a supportstructure 524), thereby being moveable along the x-axis of the componentplacement system. Bond head array 506 a and bond head array 506 b arealso both carried by a rotative motion system 526 (via a supportstructure 522), and thus bond head array 506 a and bond head array 506 bare simultaneously carried about a rotative motion axis (i.e., carriedabout the z-axis). For example, by rotating 180 degrees, the order ofthe arrays can be swapped (e.g., the bond head array on the right movesto the left and vice versa).

Bond head array 506 a is also moveable along the x-axis of the componentplacement system independently of bond head array 506 b. Morespecifically, bond head array 506 a may be moved along the x-axis,independently of bond head array 506 b, using an x-axis motion system508 b (e.g., a short stroke actuator). Each of bond head arrays 506 a,506 b includes a plurality of pick up tools 510 (e.g., pick and placetools, such as pipettes, grippers, etc.).

Thus, in summary, FIG. 5 illustrates (i) a single y-axis motion system504 (e.g., a long stroke motion system) for carrying the two bond headarrays 506 a, 506 b; (ii) a single x-axis motion system 508 a (e.g., along stroke motion system) for carrying the two bond head arrays 506 a,506 b; and (iii) a single rotative motion system 526 for carrying bondhead array 506 a and bond head array 506 b about a rotative motion axis.Further, bond head array 506 a can be moved independently from bond headarray 506 b along the x-axis using x-axis motion system 508 b.

Referring now to the overhead view of FIG. 6 , three distinct pick uptools 610 are illustrated, each being carried by a respective one ofsupport structures 630 a, 630 b, and 630 c. Each of linear motionsystems 628 a, 628 b, and 628 c are provided to move a respective one ofsupport structures 630 a, 630 b, and 630 c (and hence, the respectivepick up tool 610) with respect to a support structure 622 (where supportstructure 622 may be considered a bond head).

As detailed below, a support structure 616 carries support structure 622via a linear motion system 608 a (e.g., an x-axis motion system), asupport structure 624, and a rotative motion system 626. Further,another support structure 614 carries support structure 616. Morespecifically, support structure 616 (and hence each of pick up tools610) can be moved along the y-axis of the component placement systemusing a linear motion system 604 (e.g., a long stroke actuator, a y-axismotion system, etc.). Each of the three pick up tools 610 are carried bylinear motion system 608 a (e.g., a long stroke actuator, an x-axismotion system, etc.) (via support structure 624), thereby being moveablealong the x-axis of the component placement system. Each of the threepick up tools are also carried by rotative motion system 626 (viasupport structure 622), and thus are simultaneously carried about arotative motion axis (i.e., carried about the z-axis).

Thus, in summary, FIG. 6 illustrates (i) a single linear motion system604 (e.g., a long stroke motion system, a y-axis motion system, etc.)for carrying the three pick up tools 610; (ii) a single linear motionsystem 608 a (e.g., a long stroke motion system, an x-axis motionsystem, etc.) for carrying the three pick up tools 610; and (iii) asingle rotative motion system 626 for carrying the three pick up tools610 about a rotative motion axis. Further, each of the three pick uptols 610 can be moved independently along a respective linear axis usingrespective linear motion system 628 a, 628 b, and 628 c (e.g., shortstroke linear actuators). By choosing the right positioning of thelinear motion systems 628 a, 628 b, and 628 c with a desired rotationangle of rotative motion system 626, the three pick up tools 610 (e.g.,pipettes, grippers, etc.) can be arranged in any desired configuration.

FIGS. 7-8 are flow diagrams illustrating methods of operating acomponent placement system. As is understood by those skilled in theart, certain steps included in the flow diagrams may be omitted; certainadditional steps may be added; and the order of the steps may be alteredfrom the order illustrated—all within the scope of the invention.

Referring now to FIG. 7 , in Step 700, a first plurality of electroniccomponents are carried using a first bond head array. In Step 702, asecond plurality of electronic components is carried using a second bondhead array. In Step 704, the first bond head array and the second bondhead array are moved along a first motion axis simultaneously using afirst motion system (e.g., bond head arrays 106 a, 106 b are moved alongthe y-axis using y-axis motion system 104; bond head arrays 106 a, 106 bare moved along the x-axis using a motion system including the twox-axis motion systems 108) (e.g., bond head arrays 206 a, 206 b aremoved along the y-axis using y-axis motion system 204; bond head arrays206 a, 206 b are moved along the x-axis using a motion system includingthe two x-axis motion systems 208 a, 208 b). Step 706, the first bondhead array is moved independent of the second bond head array using asecond motion system (e.g., bond head array 106 b is moved independentof bond head array 106 a using y-axis motion system 120) (e.g., bondhead array 206 a is moved independent of bond head array 206 b usingy-axis motion system 220).

Referring now to FIG. 8 , in Step 800, a plurality of linear motionsystems are carried using a first support structure, each of theplurality of linear motion systems being configured to move one of aplurality of pick up tools configured for carrying an electroniccomponent. In Step 802, the first support structure is carried with asecond support structure. In Step 804, the first support structure ismoved with respect to the second support structure about a rotativemotion axis using a rotative motion system (e.g., see FIG. 6 wheresupport structure 622 is moved with respect to support structure 624about a rotative axis using rotative motion system 626). In optionalStep 806, the second support structure is carried with a third supportstructure. In optional Step 808, the second support structure is movedwith respect to the third support structure along a first linear motionaxis using another linear motion system (e.g., see FIG. 6 where supportstructure 624 is moved with respect to support structure 616 usinglinear motion system 608 a). In optional Step 810, the third supportstructure is carried with a fourth support structure. In optional Step812, the third support structure is moved with respect to the fourthsupport structure along a second linear motion axis using yet anotherlinear motion system (e.g., see FIG. 6 where support structure 616 ismoved with respect to support structure 614 using linear motion system604).

As will be appreciated by those skilled in the art, the pick and placetools (e.g., pick up tools, pipettes, grippers, etc.) described hereinare configured to pick and/or place any electronic component as neededin a given application. Exemplary electronic components includesemiconductor elements, discrete components, and any other electroniccomponent which may be placed using the inventive component placementsystems described herein.

As will be appreciated by those skilled in the art, the motion systemsdescribed herein (e.g., y-axis motion systems, x-axis motion systems,linear motion systems, rotative motion systems, etc.) are shown in asimplified form. Such motion systems may include various subcomponents,and may be considered to be manipulators, actuators, motors, or anyother type of motion system applicable to the inventive componentplacement systems described herein.

Although the invention is illustrated and described herein withreference to specific embodiments, the invention is not intended to belimited to the details shown. Rather, various modifications may be madein the details within the scope and range of equivalents of the claimsand without departing from the invention.

What is claimed:
 1. A component placement system comprising: a firstbond head array configured for simultaneously carrying a first pluralityof electronic components; a second bond head array configured forsimultaneously carrying a second plurality of electronic components; afirst motion system for simultaneously carrying the first bond headarray and the second bond head array along a first motion axis; a secondmotion system for carrying the first bond head array independent of thesecond bond head array; and a rotative motion system for simultaneouslycarrying the first bond head array and the second bond head array abouta rotative motion axis.
 2. The component placement system of claim 1wherein the first motion system includes a long stroke actuator.
 3. Thecomponent placement system of claim 1 wherein the first motion axisincludes a linear axis of the component placement system.
 4. Thecomponent placement system of claim 3 wherein the first motion axis isan x-axis or a y-axis of the component placement system.
 5. Thecomponent placement system of claim 1 wherein the first motion system isconfigured for simultaneously carrying the first bond head array and thesecond bond head array along the first motion axis, and forsimultaneously carrying the first bond head array and the second bondhead array along a second motion axis.
 6. The component placement systemof claim 5 wherein the first motion axis is a y-axis of the componentplacement system, and the second motion axis is an x-axis of thecomponent placement system.
 7. The component placement system of claim 5wherein the second motion system is carried by the first motion system.8. The component placement system of claim 5 wherein the second motionsystem is configured for carrying the first bond head array, independentof the second bond head array, along the first motion axis and thesecond motion axis.
 9. The component placement system of claim 8 whereinthe first motion axis is a y-axis of the component placement system, andthe second motion axis is an x-axis of the component placement system.10. The component placement system of claim 1 wherein the first motionaxis is substantially perpendicular to a motion axis along which thefirst bond head array is carried by the second motion system.
 11. Thecomponent placement system of claim 1 wherein the first motion axis issubstantially parallel to a motion axis along which the first bond headarray is carried by the second motion system.
 12. The componentplacement system of claim 1 further comprising a third motion system forcarrying the second bond head array independent of the first bond headarray.
 13. The component placement system of claim 12 wherein a motionaxis of the second motion system is substantially parallel to a motionaxis of the third motion system.
 14. The component placement system ofclaim 13 further comprising another motion system for carrying the firstbond head array, independent of the second bond head array, along anaxis substantially perpendicular to the motion axis of the second motionsystem and the motion axis of the third motion system.
 15. The componentplacement system of claim 14 wherein the axis of the another motionsystem is substantially parallel to the first motion axis.
 16. Thecomponent placement system of claim 1 further comprising another motionsystem for carrying the first bond head array along a motion axissubstantially perpendicular to a motion axis of the second motionsystem.
 17. The component placement system of claim 1 wherein therotative motion system is carried by the first motion system.
 18. Acomponent placement system comprising: a first bond head arrayconfigured for simultaneously carrying a first plurality of electroniccomponents; a second bond head array configured for simultaneouslycarrying a second plurality of electronic components; a first motionsystem for simultaneously carrying the first bond head array and thesecond bond head array along a first motion axis and a second motionaxis; a second motion system for carrying the first bond head arrayindependent of the second bond head array; and a rotative motion systemfor simultaneously carrying the first bond head array and the secondbond head array about a rotative motion axis.
 19. The componentplacement system of claim 18 wherein the first motion system includes along stroke actuator.
 20. The component placement system of claim 18wherein the first motion axis includes a linear axis of the componentplacement system.
 21. The component placement system of claim 20 whereinthe first motion axis is an x-axis or a y-axis of the componentplacement system.
 22. The component placement system of claim 18 whereinthe first motion axis is a y-axis of the component placement system, andthe second motion axis is an x-axis of the component placement system.23. The component placement system of claim 18 wherein the second motionsystem is carried by the first motion system.
 24. The componentplacement system of claim 18 wherein the second motion system isconfigured for carrying the first bond head array, independent of thesecond bond head array, along the first motion axis and the secondmotion axis.
 25. The component placement system of claim 24 wherein thefirst motion axis is a y-axis of the component placement system, and thesecond motion axis is an x-axis of the component placement system. 26.The component placement system of claim 18 wherein the first motion axisis substantially perpendicular to a motion axis along which the firstbond head array is carried by the second motion system.
 27. Thecomponent placement system of claim 18 wherein the first motion axis issubstantially parallel to a motion axis along which the first bond headarray is carried by the second motion system.
 28. The componentplacement system of claim 18 further comprising a third motion systemfor carrying the second bond head array independent of the first bondhead array.
 29. The component placement system of claim 28 wherein amotion axis of the second motion system is substantially parallel to amotion axis of the third motion system.
 30. The component placementsystem of claim 29 further comprising another motion system for carryingthe first bond head array, independent of the second bond head array,along an axis substantially perpendicular to the motion axis of thesecond motion system and the motion axis of the third motion system. 31.The component placement system of claim 30 wherein the axis of theanother motion system is substantially parallel to the first motionaxis.
 32. The component placement system of claim 18 further comprisinganother motion system for carrying the first bond head array along amotion axis substantially perpendicular to a motion axis of the secondmotion system.
 33. The component placement system of claim 18 whereinthe rotative motion system is carried by the first motion system. 34.The component placement system of claim 33 wherein the second motionsystem is configured for carrying the first bond head array, independentof the second bond head array, along the first motion axis and thesecond motion axis.
 35. The component placement system of claim 34wherein the first motion axis is a y-axis of the component placementsystem, and the second motion axis is an x-axis of the componentplacement system.